IEC 60749-19 Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength - Edition 1.1 Consolidated Reprint
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC 62047-15 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass - Edition 1.0
- 31
- IEC 62047-15 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass - Edition 1.0
- 31.080
- IEC 62047-15 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass - Edition 1.0
- 31.080.99
- IEC 62047-9 Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS - Edition 1.0
- IEC 62047-9 Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS - Edition 1.0
- IEC 62047-4 Semiconductor devices – Micro-electromechanical devices – Part 4: Generic specification for MEMS - Edition 1.0
- IEC 62047-9 CORR 1 Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS - Edition 1.0
- BSI BS EN 62047-15 Semiconductor devices — Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
- CENELEC EN 62047-9 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
- Картотека зарубежных и международных стандартов
