BSI BS EN 60749-19 + A1 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength - AMD: October 31, 2010
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- BSI BS EN 60749-19 + A1 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength - AMD: October 31, 2010
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- BSI BS EN 60749-19 + A1 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength - AMD: October 31, 2010
- 31.080
- IEC 62047-9 Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS - Edition 1.0
- IEC 62047-9 Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS - Edition 1.0
- IEC 62047-4 Semiconductor devices – Micro-electromechanical devices – Part 4: Generic specification for MEMS - Edition 1.0
- BSI BS EN 62047-9 Semiconductor devices - Micro-electromechanical devices Part 9: Wafer to wafer bonding strength measurement for MEMS - CORR: January 31, 2013
- Картотека зарубежных и международных стандартов
