BSI BS 6312-2.2 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.2: Particular requirements for fixed socket-outlets used in permanent wiring installations - AMD 15632: August 24, 2005
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- 03
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- 03.100
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- 03.100.50
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- 31
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 6312-2.2 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.2: Particular requirements for fixed socket-outlets used in permanent wiring installations - AMD 15632: August 24, 2005
- BSI BS 6312-1 Connectors for analogue telecommunication interfaces - Part 1. Specification for plugs
- BSI BS 6312-2.1 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.1 Specification for sockets - general requirements
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- Картотека зарубежных и международных стандартов
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- BSI BS EN 60068-2-78 Environmental Testing Part 2-78: Tests - Test Cab: Damp Heat, Steady StateОкружающее влияние. Методы испытания. Проверка кеб: Влажность тепло, постоянно
Карточка документа - IEC 60068-2-78 Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state - Edition 2.0Испытания на воздействия окружающих условий – Часть 2-78: Тесты – Испытательное Такси: Влажное тепло, устойчивое состояние - Издание 2.0
Карточка документа - BSI BS EN 60068-2-2 Environmental testing - Part 2-2: Tests - Test B: Dry heatОкружающее влияние. Методы испытания. Проверка B. Сухое тепло
Карточка документа - IEC 60068-2-2 Environmental testing – Part 2-2: Tests – Test B: Dry heat - Edition 5.0Испытания на воздействия окружающих условий – Часть 2-2: Тесты – Тест B: Сухое тепло - Издание 5.0
На основе IEC 60068-2-2 разработаны ГОСТ Р МЭК 60068-2-2-2009 (IDT); ГОСТ Р 51368-2011 (NEQ); ГОСТ 30630.2.1-2013 (NEQ)ГОСТ 30630.2.1-2013 (NEQ) - BSI BS EN 60068-2-1 Environmental testing - Part 2-1: Tests - Test A: ColdОкружающее влияние. Методы испытания. Проверка A. Холод
Карточка документа - BSI BS 4662 + A1 Boxes for flush mounting of electrical accessories - Requirements, test methods and dimensions - CORR 16413: May 2006; AMD 1: May 2009; CORR 1: November 2011Коробки для скрытого монтажа электрических аксессуаров - Требований, методов испытаний и измерений - CORR 16413: май 2006; AMD 1: май 2009; CORR 1: ноябрь 2011
Карточка документа - BSI BS 6312-1 Connectors for analogue telecommunication interfaces - Part 1. Specification for plugsКоннекторы для аналоговых телекоммуникационных интерфейсов - Часть 1. Спецификация для разъемов
Карточка документа - BSI BS 6312-2.1 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.1 Specification for sockets - general requirementsКоннекторы для аналоговых телекоммуникационных интерфейсов - Часть 2: Сокеты для использования с разъемами, определенными в BS 6312-1 - Раздела 2.1 Спецификации для сокетов - общие требования
Карточка документа - BSI BS EN 123000 Harmonized System of Quality Assessment for Electronic Components Generic Specification: Printed Boards - AMD 7145: May 1992; AMD 9249: September 1996; ADD: August 15, 1997Согласованная система качественной оценки для электронных компонентов универсальная спецификация: печатные платы - AMD 7145: май 1992; AMD 9249: сентябрь 1996; ADD: 15 августа 1997
Карточка документа - BSI BS CECC 30401 023 Fixed Metallized Polyethylene Terephthalate Film d.c. Dielectric Capacitors Rectangular Non- Metallic Case: Detail Specification: Full Assessment - AMD 3894: September 30, 1982Фиксированный Металлизованный Фильм Терефталата Полиэтилена d.c. Диэлектрические Конденсаторы, Прямоугольные не - Металлический Случай: Спецификация Детали: Полная Оценка - AMD 3894: 30 сентября 1982
Карточка документа - BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment LevelФиксированная низкая мощность не - проволочные резисторы, изолированные. Типичная конструкция: фильм оксида металла спиральным образом сокращение: спецификация детали: полный уровень оценки
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