BSI BS 6312-2.1 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.1 Specification for sockets - general requirements
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- 03
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- 03.100
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- 03.100.50
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- 31
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- IEC QC 001004 International Electrotechnical Commission Quality Assessment System for Electronic Components (IECQ) - Specifications List - Issue 1; Edition 2.0
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS QC 300203 Specification for Harmonized system of quality assessment for electronic components - AMD 5947: September 1988
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS 9000-3 General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS CECC 40101 019 Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level
- BSI BS 6312-2.2 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.2: Particular requirements for fixed socket-outlets used in permanent wiring installations - AMD 15632: August 24, 2005
- BSI BS 6312-2.1 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.1 Specification for sockets - general requirements
- BSI BS 6312-1 Connectors for analogue telecommunication interfaces - Part 1. Specification for plugs
- IEC TS 62239 Process management for avionics Preparation of an electronic components management plan - Edition 1.0
- Картотека зарубежных и международных стандартов
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- BSI BS 7940 Analogue PSTN Terminal Support InterfaceАналогичные PSTN Конечный поддерживающий интерфейс
Карточка документа - BSI BS 6312-2.2 Connectors for analogue telecommunication interfaces - Part 2: Sockets for use with plugs specified in BS 6312-1 - Section 2.2: Particular requirements for fixed socket-outlets used in permanent wiring installations - AMD 15632: August 24, 2005Коннекторы для аналоговых телекоммуникационных интерфейсов - Часть 2: Сокеты для использования с разъемами, определенными в BS 6312-1 - Раздел 2.2: Определенные требования для фиксированных выходов сокета, используемых в постоянных установках проводного соединения - AMD 15632: 24 августа 2005
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