JSA JIS C 60068-2-83 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- JSA JIS C 60068-3-7 Environmental testing - Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load)
- 19
- JSA JIS C 60068-3-7 Environmental testing - Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load)
- 19.040
- JSA JIS C 60068-3-5 Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
- 29
- JSA JIS C 60068-3-7 Environmental testing - Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load)
- 29.020
- JSA JIS C 60068-3-5 Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
- JSA JIS C 60068-1 Environmental testing Part 1: General and guidance
- Картотека зарубежных и международных стандартов
Japanese Standards Association
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
N JIS C 60068-2-83
Автоматический перевод:
Испытания на воздействия окружающих условий - Часть 2-83: Тесты - Тест Tf: тестирование Паяемости электронных компонентов для устройств монтажа на поверхность (SMD) балансовым методом смачивания с помощью припойной пасты
Эквиваленты данного стандарта:
- CEI EN 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- BSI BS EN 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- IEC 60068-2-83 Environmental testing – Part 2-83: Tests – Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste - Edition 1.0
- CENELEC EN 60068-2-83 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- DIN EN 60068-2-83 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011
