IEC 60068-2-44 Environmental Testing - Part 2: Tests - Guidance on Test T: Soldering - Edition 2.0; Includes Corrigendum 1: 08/1995
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 19.040
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- IEC TR 60068-3-12 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- Картотека зарубежных и международных стандартов
International Electrotechnical Commission
Environmental Testing - Part 2: Tests - Guidance on Test T: Soldering - Edition 2.0; Includes Corrigendum 1: 08/1995
N IEC 60068-2-44
Annotation
The purpose of this International Standard is to provide background information and recommendations for writers of specifications containing references to IEC 68-2-20, IEC 68-2-54 and IEC 68-2-58.
Автоматический перевод:
Экологическое испытание - часть 2: испытания - руководство на испытании T: запаивание - издание 2.0; включает исправление 1: 08/1995
Цель этого Международного стандарта состоит в том, чтобы обеспечить справочную информацию и рекомендации для писателей спецификаций, содержащих ссылки на IEC 68-2-20, IEC 68-2-54 и IEC 68-2-58.
Эквиваленты данного стандарта:
- AENOR UNE-EN 60068-2-44 ENVIRONMENTAL TESTING. PART 2: TESTS. GUIDANCE ON TEST T: SOLDERING.
- IEC 60068-2-20 Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads - Edition 5.0
- CENELEC HD 323.2.58 S1 Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
- CENELEC HD 323.2.44 S1 Basic Environmental Testing Procedures - Part 2: Tests. Guidance on Test T: Soldering
- CENELEC EN 60068-2-21 Environmental Testing - Part 2-21: Tests - Test U: Robustness of Terminations and Integral Mounting Devices
- CENELEC EN 60068-2-44 Environmental Testing Part 2: Tests Guidance on Test T: Soldering
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC HD 323.2.54 Basic Environmental Testing Procedures Part 2: Tests Test TA: Soldering, Solderability Testing by the Wetting Balance Method
- DS DS/EN 60068-2-44 Environmental testing – Part 2: Tests – Guidance on Test T: Soldering
- BSI BS EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- JSA JIS C 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- DS DS/EN 60068-2-21 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- BSI BS EN 60068-2-44 Environmental testing - Part 2: Tests - Guidance on Test T. Soldering
- AENOR UNE-EN 60068-2-21 Environmental testing -- Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:2006)
- BSI BS EN 60068-2-58 Environmental testing Part 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- BSI BS EN 60068-2-54 Environmental testing Part 2-54: Tests Test Ta: Solderability testing of electronic components by the wetting balance method
- IEC 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 4.0
- AENOR UNE-EN 60068-2-54 Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006)
- BSI BS EN 60068-2-21 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices - CORR: April 30, 2012
- AENOR UNE-EN 60068-2-58 Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- DS DS/EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- CENELEC EN 60068-2-54 Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
- CEI EN 60068-2-58 Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- JSA JIS C 60068-2-54 Environmental testing - Part 2-54: Tests-Test Ta: Solderability testing of electronic components by the wetting balance method
