Comitato Elettrotecnico Italiano

Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
 N EN 61760-4

Annotation

This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.

This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.

This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to

• semiconductor devices,

• devices for flow (wave) soldering.

NOTE Background of this standard and its relation to currently

Автоматический перевод:

Технологическая Часть 4 монтажа на поверхность: Классификация, упаковка, маркировка и обработка влажности чувствительные устройства

Эта часть IEC 61760 указывает классификацию влажности чувствительные устройства на уровни уязвимости влажности, связанные с запаиванием тепла и условий для упаковки, маркировки и обработки.