CENELEC EN 60191-6-5 Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
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- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- 29.020
- AENOR UNE-EN 60068-3-7 Environmental testing -- Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load).
- AENOR UNE-EN 60068-2-2 Environmental testing -- Part 2-2: Tests - Tests B: Dry heat. (IEC 60068-2-2:2007)
- AENOR UNE-EN 50130-5 Alarm systems - Part 5: Environmental test methods
- IEC 60068-3-4 Environmental Testing - Part 3-4: Supporting Documentation and Guidance - Damp Heat Tests - Edition 1.0
- BSI BS EN 60127-6 Miniature fuses Part 6: Fuse-holders for miniature fuse-links
- CENELEC EN 60068-2-21 Environmental Testing - Part 2-21: Tests - Test U: Robustness of Terminations and Integral Mounting Devices
- BSI BS EN 62137-4 Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- Картотека зарубежных и международных стандартов
European Committee for Electrotechnical Standardization
Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
N EN 60191-6-5
Автоматический перевод:
Механическая стандартизация полупроводниковой части 6-5 устройств: общие правила для подготовки контурных рисунков поверхностных смонтированных полупроводниковых пакетов устройства - руководство по проектированию для массива шариковых выводов с резьбой малого шага (FBGA)
Эквиваленты данного стандарта:
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- DS DS/EN 60191-6-5 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
- AENOR UNE-EN 60191-6-5 Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
- BSI BS EN 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
