AENOR UNE-EN 60191-6-5 Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
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Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
Asociacion Espanola de Normalizacion y Certificacion
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
N UNE-EN 60191-6-5
Автоматический перевод:
Механическая стандартизация полупроводниковых устройств - Часть 6-5: Общие правила для подготовки контурных рисунков поверхности смонтировали полупроводниковый пакет устройства - Руководство по проектированию для штрафа - передает массив шариковых выводов (FBGA).
Эквиваленты данного стандарта:
- IEC 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA) - Edition 1.0
- DS DS/EN 60191-6-5 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
- CENELEC EN 60191-6-5 Mechanical Standardization of Semiconductor Devices Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
- BSI BS EN 60191-6-5 Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine-Pitch Ball Grid Array (FBGA)
