CENELEC EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Список продуктов
Данный раздел/документ содержится в продуктах:
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- 31
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- 31.080
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- 31.080.01
- BSI BS EN 60749-40 Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
- BSI BS EN 60749-20 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- IEC 60749-40 Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge - Edition 1.0
- IEC 60749-37 Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer - Edition 1.0
- CENELEC EN 60749-40 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
- Картотека зарубежных и международных стандартов
European Committee for Electrotechnical Standardization
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
N EN 60749-37
Автоматический перевод:
Полупроводниковые устройства - Механические и климатические методы тестирования - Часть 37: метод испытания на падение На уровне плат с помощью акселерометра
Эквиваленты данного стандарта:
- IEC 60749-37 Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer - Edition 1.0
- BSI BS EN 60749-37 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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