BSI BS EN 60068-2-44 Environmental testing - Part 2: Tests - Guidance on Test T. Soldering
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Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
- MODUK DEF STAN 61-21: SUPP 033 General Specification for Batteries Supplement 033 Silver Oxide Battery 1.55V, NSN 6135-99-984-7838 - Issue 2: 06/2009
- MODUK DEF STAN 61-21: SUPP 012 General Specification for Batteries Supplement 012 Alkaline Manganese Battery 3V, NSN 6135-99-650-7680 - Issue 2: 06/2009
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- MODUK DEF STAN 61-21: SUPP 045 General Specification For Batteries Supplement 045 Alkaline Manganese Battery 6V NSN 6135-99-222-2993 - Issue 2: 8/2009
- MODUK DEF STAN 61-21: SUPP 050 General Specification For Batteries Supplement 050 Lithium Thionyl Chloride Battery 14V 238Ah (Nominal), NSN 6135-99-425-1573 - Issue 2: 08/2009
- MODUK DEF STAN 61-21: SUPP 034 General Specification for Batteries Supplement 034 Silver Oxide Battery 1.55V, NSN 6135-99-326-3024 - Issue 2: 06/2009
- MODUK DEF STAN 61-21: SUPP 019 General Specification for Batteries Supplement 019 Specification for Secondary Nickel Cadmium Battery, 24V, 5Ah NSN 6140-99-620-8057 - Issue 2: 06/2009
- BSI BS EN 60068-2-66 Environmental testing Part 2: Test methods Test Cx. Damp heat, steady state (unsaturated pressurized vapour)
- BSI BS EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- BSI BS EN 60068-2-54 Environmental testing Part 2-54: Tests Test Ta: Solderability testing of electronic components by the wetting balance method
- Картотека зарубежных и международных стандартов
British Standards Institution
Environmental testing - Part 2: Tests - Guidance on Test T. Soldering
N BSI BS EN 60068-2-44
Annotation
Provides background information and recommendations for writers of specifications containing references to standards relating to soldering and solderability.
Автоматический перевод:
Экологическое испытание - Часть 2: Испытания - Руководство на Испытании T. Запаивание
Обеспечивает справочную информацию и рекомендации для писателей спецификаций, содержащих ссылки на стандарты, касающиеся запаивания и паяемости.
Эквиваленты данного стандарта:
- AENOR UNE-EN 60068-2-44 ENVIRONMENTAL TESTING. PART 2: TESTS. GUIDANCE ON TEST T: SOLDERING.
- IEC 60068-2-20 Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads - Edition 5.0
- CENELEC HD 323.2.58 S1 Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
- CENELEC HD 323.2.44 S1 Basic Environmental Testing Procedures - Part 2: Tests. Guidance on Test T: Soldering
- CENELEC EN 60068-2-21 Environmental Testing - Part 2-21: Tests - Test U: Robustness of Terminations and Integral Mounting Devices
- CENELEC EN 60068-2-44 Environmental Testing Part 2: Tests Guidance on Test T: Soldering
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC HD 323.2.54 Basic Environmental Testing Procedures Part 2: Tests Test TA: Soldering, Solderability Testing by the Wetting Balance Method
- DS DS/EN 60068-2-44 Environmental testing – Part 2: Tests – Guidance on Test T: Soldering
- BSI BS EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- JSA JIS C 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- DS DS/EN 60068-2-21 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- IEC 60068-2-44 Environmental Testing - Part 2: Tests - Guidance on Test T: Soldering - Edition 2.0; Includes Corrigendum 1: 08/1995
- AENOR UNE-EN 60068-2-21 Environmental testing -- Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:2006)
- BSI BS EN 60068-2-58 Environmental testing Part 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- BSI BS EN 60068-2-54 Environmental testing Part 2-54: Tests Test Ta: Solderability testing of electronic components by the wetting balance method
- IEC 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 4.0
- AENOR UNE-EN 60068-2-54 Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006)
- BSI BS EN 60068-2-21 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices - CORR: April 30, 2012
- AENOR UNE-EN 60068-2-58 Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- DS DS/EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- CENELEC EN 60068-2-54 Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
- CEI EN 60068-2-58 Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- JSA JIS C 60068-2-54 Environmental testing - Part 2-54: Tests-Test Ta: Solderability testing of electronic components by the wetting balance method
