CENELEC EN 60068-2-83 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Данный раздел/документ содержится в продуктах:
- Техэксперт: Машиностроительный комплекс
- Картотека зарубежных и международных стандартов
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- CSA CAN/CSA-E61347-1:03 Lamp controlgear – Part 1: General and safety requirements - First Edition
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
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- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
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- CSA CAN/CSA-E61347-1:03 Lamp controlgear – Part 1: General and safety requirements - First Edition
- IEC TR 60479-4 Effects of current on human beings and livestock – Part 4: Effects of lightning strokes - Edition 2.0
- IEC TS 60479-1 CORR 2 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 2 - Edition 4.0
- CENELEC EN 61140 Protection against electric shock - Common aspects for installation and equipment
- IEC TS 60479-1 CORR 1 Effects of current on human beings and livestock – Part 1: General aspects CORRIGENDUM 1 - Edition 4.0
- Картотека зарубежных и международных стандартов
European Committee for Electrotechnical Standardization
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
N EN 60068-2-83
Annotation
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.
Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
Автоматический перевод:
Испытания на воздействия окружающих условий - Часть 2-83: Тесты - Тест Tf: тестирование Паяемости электронных компонентов для устройств монтажа на поверхность (SMD) балансовым методом смачивания с помощью припойной пасты
Эта часть IEC 60068 предоставляет методы для сравнительного расследования смачиваемости металлических завершений или металлизировавших завершений SMDs с припойными пастами.
