DS DS/EN 60068-2-44 Environmental testing – Part 2: Tests – Guidance on Test T: Soldering
DANSK - Dansk Standard
Environmental testing – Part 2: Tests – Guidance on Test T: Soldering
N DS DS/EN 60068-2-44
Annotation
The standard gives background information for choice of solder, choice of flux, temperature of test, ageing, as well as for choice of test method: the globule test, the solder bath test, the soldering iron test, solderability and de-wetting phenomena, resistance to soldering heat.
Автоматический перевод:
Экологическое испытание – Часть 2: Испытания – Руководство на Испытании T: Запаивание
Стандарт дает справочную информацию для выбора припоя, выбора потока, температуры теста, старения, а также для выбора метода тестирования: тест капли, тест ванны припоя, тест паяльника, паяемость и явления de-смачивания, сопротивление запаиванию тепла.
Эквиваленты данного стандарта:
- AENOR UNE-EN 60068-2-44 ENVIRONMENTAL TESTING. PART 2: TESTS. GUIDANCE ON TEST T: SOLDERING.
- IEC 60068-2-20 Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads - Edition 5.0
- CENELEC HD 323.2.58 S1 Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
- CENELEC HD 323.2.44 S1 Basic Environmental Testing Procedures - Part 2: Tests. Guidance on Test T: Soldering
- CENELEC EN 60068-2-21 Environmental Testing - Part 2-21: Tests - Test U: Robustness of Terminations and Integral Mounting Devices
- CENELEC EN 60068-2-44 Environmental Testing Part 2: Tests Guidance on Test T: Soldering
- IEC 60068-2-54 Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method - Edition 2.0
- CENELEC EN 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- CENELEC HD 323.2.54 Basic Environmental Testing Procedures Part 2: Tests Test TA: Soldering, Solderability Testing by the Wetting Balance Method
- BSI BS EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- JSA JIS C 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- DS DS/EN 60068-2-21 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC 60068-2-21 CORR 1 Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices - Edition 6.0
- CENELEC EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- BSI BS EN 60068-2-44 Environmental testing - Part 2: Tests - Guidance on Test T. Soldering
- IEC 60068-2-44 Environmental Testing - Part 2: Tests - Guidance on Test T: Soldering - Edition 2.0; Includes Corrigendum 1: 08/1995
- AENOR UNE-EN 60068-2-21 Environmental testing -- Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:2006)
- BSI BS EN 60068-2-58 Environmental testing Part 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- BSI BS EN 60068-2-54 Environmental testing Part 2-54: Tests Test Ta: Solderability testing of electronic components by the wetting balance method
- IEC 60068-2-58 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) - Edition 4.0
- AENOR UNE-EN 60068-2-54 Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006)
- BSI BS EN 60068-2-21 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices - CORR: April 30, 2012
- AENOR UNE-EN 60068-2-58 Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- DS DS/EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- CENELEC EN 60068-2-54 Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
- CEI EN 60068-2-58 Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- JSA JIS C 60068-2-54 Environmental testing - Part 2-54: Tests-Test Ta: Solderability testing of electronic components by the wetting balance method
