CENELEC HD 323.2.58 S1 Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
European Committee for Electrotechnical Standardization
Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
N HD 323.2.58 S1
Автоматический перевод:
Испытания на воздействия окружающих условий - часть 2: тест на тесты Td: паяемость, сопротивление растворению металлизации и спаиванию тепла Устройств монтажа на поверхность (SMD)
Эквиваленты данного стандарта:
- AENOR UNE-EN 60068-2-44 ENVIRONMENTAL TESTING. PART 2: TESTS. GUIDANCE ON TEST T: SOLDERING.
- BSI BS EN 60068-2-20 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- AENOR UNE-EN 60068-2-21 Environmental testing -- Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:2006)
- BSI BS EN 60068-2-58 Environmental testing Part 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- BSI BS EN 60068-2-21 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices - CORR: April 30, 2012
- AENOR UNE-EN 60068-2-58 Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
